Huawei and China’s CMXT are rolling out HBM3 chips to power the next wave of AI
Huawei and the leading Chinese semiconductor firm, CMXT (ChangXin Memory Technologies), are partnering to deliver high‑bandwidth memory (HBM) chips in China. The move is part of China’s push to hit its AI targets by 2026 and could see large‑scale production by the end of this year.
CMXT – China’s rising chipmaker
CMXT is a top player in the Chinese memory market, designing and fabricating DRAM for servers, phones and PCs. Despite heavy US restrictions, it is leading China’s efforts to build a domestic supply chain for advanced DRAM and HBM processors. The latest milestone is the delivery of HBM3 samples to Chinese customers, a key pre‑production test before full manufacturing begins.
What is HBM, and why it matters
HBM, or High Bandwidth Memory, is an advanced memory technology built on a 3‑D stacked design. By stacking several DRAM dies vertically, it creates shorter, faster data paths to the main processor, delivering peak performance and power efficiency that’s vital for AI workloads.
CMXT sends HBM3 samples to Huawei
Reports say CMXT has already supplied HBM3 chip samples to Huawei and other local clients. Analysts view this as a “precursor” move that signals the kick‑off of mass production later this year.
While some experts note that CMXT lags 3–4 years behind industry leaders like Samsung, SK Hynix and Micron, the company has made significant progress. Its yield rate and cost efficiency are still below global best practice, but its current yield is only slightly behind Samsung’s.
Production outlook and growth targets
CMXT plans to produce 230,000–280,000 DRAM wafers each month this year, with a target of 290,000–300,000 wafers next year—an expected revenue jump of over 60 %. The firm already began producing DDR5 memory, aiming for an 80 % yield.
To hit these goals, CMXT has outsourced basic die technology to contractors like Nexchip and is building a new backend packaging plant in Shanghai. The company also plans to launch HBM3E in China by 2027, a goal that still lags behind the international pace – most global players will roll out HBM4 by that time.
Why this matters for South Africa
As South African companies look to strengthen their own tech supply chains, China’s move towards self‑reliance in high‑performance memory shows how rapidly the industry is shifting. The HBM3 rollout will likely spark a new wave of AI development across Asia, creating opportunities for collaborative research, talent exchange, and new markets that South African engineers and businesses can tap into.
(Image credits: Samsung)
The post “Huawei, CMXT mapping HBM3 chip progress to elevate AI growth” first appeared on Huawei Central.
